Chemodex

Tetrakis(trimethylsilyl)silane

CHF 155.00
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CDX-T0492-G0055 gCHF 155.00
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Product Details
Synonyms 2,2-Bis(trimethylsilyl)-1,1,1,3,3,3-hexamethyl-trisilane; TTMSS
Product Type Chemical
Properties
Formula (CH3)3Si]4Si
MW 320.84
CAS 4098-98-0
Source/Host Chemicals Synthetic
Purity Chemicals ≥97% (GC)
Appearance White to off-white powder.
Solubility Soluble in chloroform (100mg/ml).
Identity Determined by 1H-NMR.
Declaration Manufactured by Chemodex.
Other Product Data

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InChi Key BOJSDHZZKKYWAS-UHFFFAOYSA-N
Smiles C[Si](C)(C)[Si]([Si](C)(C)C)([Si](C)(C)C)[Si](C)(C)C
Shipping and Handling
Shipping AMBIENT
Short Term Storage +4°C
Long Term Storage +4°C
Handling Advice Protect from light and moisture.
Use/Stability Stable for at least 2 years after receipt when stored at +4°C.
Documents
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Product Specification Sheet
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Description

Tetrakis(trimethylsilyl)silane (TTMSS) is an organosilicon compound. TTMSS is widely used as a reagent and precursor in organic synthesis and silicon-based chemistry. TTMSS is commonly used as a protecting group for various functional groups in organic synthesis, in deoxygenation reactions to remove oxygen-containing functional groups like ketones, aldehydes, and esters, converting them into the corresponding trimethylsilyl ethers. TTMSS is utilized in silylation reactions to introduce trimethylsilyl groups onto organic compounds, enhancing their volatility and stability for gas chromatography and mass spectrometry analysis. Due to its diverse applications in organic chemistry, Tetrakis(trimethylsilyl)silane has become a valuable tool for synthetic chemists, particularly in the fields of silicon-based chemistry, protecting group strategies, and cross-coupling reactions.

Product References

(1) C.H. Ming, et al.; J. Organomet. Chem. 316, 255 (1986) | (2) J. Lalevee, et al.; J. Org. Chem. 72, 6434 (2007) | (3) E. Perret, et al.; J. Phys. Condens. Matter 22, 235102 (2010) | (4) L.D. Funt, et al.; J. Org. Chem. 82, 7583 (2017) | (5) C. Chatgilialoglu, et al.; Chem. Rev. 118, 6516 (2018) | (6) Y. Lee, et al.; J. Nanosci. Nanotechnol. 21, 2139 (2021) | (7) S. George, et al.; Org. Lett. 25, 4345 (2023)

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